STRENGTH
Process Capability
| Serial number | project | Process Capability |
| 1 | Sheet or metal base type | FR-4, CEM-3, aluminum substrate, copper substrate |
| 2 | Aluminum model | 1060, 3003, 5052, 6061 |
| 3 | Finished board thickness | 0.4-5.0mm |
| 4 | Insulation thickness | 90-180um |
| 5 | Maximum panel size | 1500mm × 600mm |
| 6 | Thermal Conductivity | 0.5W/mK~8W/mK |
| 7 |
Withstand voltage coefficient (according to material characteristics) |
DC：3000V/5mA to 7000V/5mA |
| AC：1200V/5mA to 5000V/5mA | ||
| 8 | Minimum line width/spacing | 0.15/0.15mm（1oz） |
| 9 | Minimum distance from line to board edge | Power products: ≥ finished board thickness; LED products: ≥ 0.4mm |
| 10 | Copper foil thickness | H oz, 1 oz, 2 oz,3OZ |
| 11 | Minimum finished hole diameter | FR4 0.3mm aluminum base plate 0.8MM (and ≥ finished plate thickness) |
| 12 | Finished hole tolerance (NPTH) | ±0.05mm |
| 13 | Hole position accuracy (compare CAD data) | ±0.1mm |
| 14 | Minimum countersunk hole diameter | 2.5mm |
| 15 | Minimum counterbore depth | 0.8mm |
| 16 | Counterbore depth tolerance | ±0.20mm |
| 17 | Counterbore angle | 90° |
| 18 | Minimum solder mask bridge | Green oil: 0.15mm |
| White oil: 0.15mm | ||
| 19 | Surface treatment | Tin spray, OSP, immersion gold, silver plating |
| 20 | V-CUT angle | 20°, 30° |
| twenty one | V-CUT up and down offset tolerance | ±0.08mm |
| twenty two | Minimum V-CUT residual thickness tolerance | ±0.08mm |
| twenty three | Minimum thickness of V-CUT board | 0.4mm |
| twenty four | Tolerance of gong board | ± 0.10mm (normal) |
| ± 0.20mm (long strip) | ||
| 25 | Outer tolerance of punching plate | ± 0.10mm |
| 26 | Highest test insulation resistance | 100 MΩ |
| 27 | Minimum test conductive resistance | 10Ω |
| 28 | CD processing angle range | 0-90° |
| 29 | CD processing R angle minimum radius | 0.6mm |
| 30 | CD processing depth tolerance | ± 0.05mm |
| 31 | Minimum distance between conductor and CD processing area | 0.2mm |
| 32 | The longest distance between the aluminum cover and the CD plus area | 0.5mm |
| 33 | CD processing depth | ≥0.15 (minimum gong to penetrate the dielectric layer) mm |
| 34 | Maximum thickness of text retaining wall | 0.3mm |
| 35 | Maximum spray tin processing size | 550*700mm or less size |
| Size below 400*1200mm |